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SEMICONDUCTOR ELEMENT MANUFACTURING DEVICE AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD

The present invention provides a semiconductor element manufacturing device and a semiconductor element manufacturing method that have an efficient static elimination effect, and exhibit excellent cleanliness and chemical resistance. This semiconductor element manufacturing device includes: a stage that is equipped with a chuck pin and/or a wafer pin, and is used for holding a semiconductor wafer; and a nozzle that is used for supplying a washing solution, etching solution, or resist solution. The nozzle is a resin molded body that includes a composite resin material including carbon nanotubes and at least one fluororesin, and/or at least one selected from the chuck pin, the wafer pin, and the stage is a resin molded body that includes a composite resin material including carbon nanotubes and at least one fluororesin.


» Number: WO2019017489A1 (A1)

» Publication Date: 19//2/24/0

» Applicant: TOHO KASEI CO LTD?[JP]

» Inventor: YAMAMOTO HIROKAZU?[JP]; ITAMI HIROTAKA?[JP] (3)

» More Information

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This project has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement n° [310187].