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PS - FTI - End Users requested for sub-micron laser marking and/or etching using photonic jet

For invisible marking, anti-counterfeiting or micro-device inspection/correction, laser machining is generally limited by diffraction to around 10 µm etching or marking. A french lab developed a technique using classical industrial nanosecond laser to achieve sub-wavelength etching and wants to develop an industrial station. With a German partner specialized in laser station construction, an industrial partner is searched as final user wishing to indentify/detect defects to submit a FTI project.

Partnership(s) sought
  • Research cooperation agreement
Descripción completa

A french lab developped a technique using use shaped optical fiber tips to focus light beyond the diffraction limit in a beam called photonic jet. The technique is adapted to etch or mark surfaces of metallic, semi-conductive or glass materials. The laser spot is smaller than 1 µm, therefore the power density is also very high, typically 10-100 times larger than usually with the same laser.

Possible application fields :
- Sub-µm marking (dot, line)
- Semiconductor processing
- Bio-medical sample processing or preparation
- Generation of electronic functionalities
- Thin film processing
- 3D-machining below 10 µm
- Local thin film deposition

The consotium made of 3 partners (2 french and 1 german) is searching for an industrial partner as "End User". The company should be interested by :
- invisible marking for anti-counterfeiting,
- etching at micrometric scale one of its product to identify defects in a production chain, or to correct the defects
- micron and submicron laser process.

The partner will have to contribute to the writing of the proposal and to the right realisation of its workpackage.

Call : FTI ? Fast Track to Innovation
Cut-offs: 23 October 2018, 21 February 2019
Deadline for the EOI : 18/10/2018

Socio buscado:

- Specific area of activity of the partner: Type : SMEs, Industrial partner,

Area of activities : Industrial production

Role : "final user/end user" partner for the project, a company interested by invisible marking for anti-counterfeiting, a company interested to etch at micrometric scale one of its product to identify defects in a production chain, or to correct the defects, a company interested by micron and submicron laser process.

Contrubution to the writing of the proposal and contribution to the right realisation of its workpackage.

Advantages & innovations:

- Smaller size : Laser machining is generally limited by diffraction to around 10 µm etching or marking. Femtosecond laser can perform smaller etchings using non-linear absorption but are expensive.
- Flexibility : Laser machining is flexible, can be dynamically adapted, more than others lithographic techniques. The optical fiber is easy to move in a process and not disturbed by the laser process.
- Gain of energy : Sub- micron etchings or marking can be performed using lower mean power due to the high laser concentration.

Development Stage:

Concept stage

Programme - Call:

Evaluation scheme: Cut-offs: 23 October 2018, 21 February 2019

Acronym: MicroLase

Website: https://ec.europa.eu/easme/en/eic-fast-track-innovation-fti

Deadline: 23/10/2018

Coordinator required: No

Clasificado como: Ciencias de la vida

» Reference: RDFR20180920001

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This project has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement n° [310187].