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Laser micromachining technology for high-precision material processing offered by a Lithuanian SME

This Lithuanian company, established in 2010, mostly holds experience in designing and manufacturing laser micromachining workstations with implemented nanosecond, picosecond and femtosecond lasers for scientific and industrial applications. The company holds extensive knowledge in ultrafast laser development and applications, enabling to achieve optimized configuration of laser micromachining equipment that they develop.

Currently developed micromachining workstations are suitable for ablation, drilling, scribing and intro-volume marking processes in ever extending range of materials, including silicon, silicon carbide, sapphire, diamond, tungsten carbide, biological materials, biodegradable polymers, glass, majority of metals, ferroelectric ceramics and etc.

This micromachining technology is currently used in eight major application sectors that require high-precision material processing:
· Cold micro-marking of metals
· Thin film solar cell processing
· Flexible electronics manufacturing and selective polymer ablation
· Silicon, glass and sapphire wafer cutting and scribing
· Treatment of metal, synthetic diamond or ceramic mechanical tools
· Medical device manufacturing
· Patterning of optical and metal coatings
· Drilling of fuel injector nozzles and mechanical filters

The company is looking for long-term cooperation with industrial partners eager to innovate their precision manufacturing processes for a commercial agreement with technical assistance or researchers for co-developing and implementing the technology for scientific research purposes under a technical cooperation agreement.

» Reference: TOLT20170831001/LITHUANIA

» Sector: Manufactura Industrial Otras Tecnologías Industriales Industria

» More Information

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This project has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement n° [310187].